By Topic

Thermal/fluid characteristics of 3-D woven mesh structures as heat exchanger surfaces

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
R. A. Wirtz ; Mech. Eng. Dept./MS, Univ. of Nevada, Reno, NV, USA ; Jun Xu ; Ji-Wook Park ; D. Ruch

The present work demonstrates the fabrication methodology of a three-dimensional (3-D), aluminum wire filament, bonded mesh deployed as a heat exchange surface. A model of the effective thermal conductivity of the mesh is developed. Apparatus to measure the coolant pressure-drop and heat transfer coefficient are described. Measurements are reported for fabricated test samples of varying thickness. Mesh Stanton number and friction factor correlations for a coolant with Prandtl number equal to 9.5 (chilled water) are reported. A heat exchanger performance evaluation, comparing the 3-D woven mesh technology to another exchanger surface technology, is described. We have found that the weaving/wire bonding process must be carefully controlled to insure that target porosity, specific surface area and effective thermal conductivity are achieved. Effective thermal conductivities are found to be at least two-times larger than achieved in other comparable porous media configurations. Mesh friction factor and Stanton number are comparable to those achieved with other exchanger surface technologies. The exchanger performance comparison shows that exchangers having superior performance can be configured.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:26 ,  Issue: 1 )