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An overview of thermal management for next generation microelectronic devices

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6 Author(s)
S. S. Tonapi ; Gen. Electr. Global Res., Niskayuna, NY, USA ; R. A. Fillion ; F. J. Schattenmann ; H. S. Cole
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The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI

Date of Conference:

31 March-1 April 2003