By Topic

Break arc study for the new electrical level of 42 V in automotive applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
N. B. Jemaa ; Palms Lab., Univ. of Rennes, France ; L. Doublet ; L. Morin ; D. Jeannot

In order to fulfil the increasing need for electric power in automobiles, to satisfy the new environmental requirements and to decrease the weight of cars, the electrical supply, must be changed from the current 14 V to 42 V. In the present work using 42 V, we have studied arc parameters such as break arc duration and extinction gap for different materials, contact opening speeds and circuit loads (correlated with the time constant of the circuit, L/R). We have established that these main arc parameters are greatly enhanced compared to the 14 V arc studied in our previous work. In the case of an inductive or a resistive load, it has been found that there are two domains: a low current domain where the material has no significant effect, and a high current domain where some materials (primarily AgSnO2) induce high arc durations and large extinction gap. In addition, increasing the opening speed reduces arc duration in all cases. The increased opening speed can however, increase the extinction gap for inductive loads and decrease it for resistive circuits. We have found that reducing arc duration is always beneficial with regards to erosion but in some cases, however it may increase the extinction gap.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:25 ,  Issue: 3 )