Cart (Loading....) | Create Account
Close category search window
 

Thin-Film Circuit Techniques

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Bohrer, John J. ; International Resistance Co.

The techniques used in producing thin-film circuits are discussed. Conductive, resistive and insulating films are evaporated separately onto glass substrates to form resistors, capacitors and interconnections. Active elements, transistors and diodes are mounted in holes drilled through the substrates. Studies aimed at developing thin-film active elements are discussed briefly. Several possible methods of interconnection are presented.

Published in:

Component Parts, IRE Transactions on  (Volume:7 ,  Issue: 2 )

Date of Publication:

Jun 1960

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.