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Browse Journals & Magazines > Components, Hybrids, and Manu ...> Volume:6 Issue:3 Help

Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling

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1 Author(s)
Engelmaier, W. ; Bell Laboratories, Whippany, NJ, USA

An ana1ytica1 method is described which provides estimates to first order of the number of either power or envirnnmenta1 cyc1es 1eading to so1der joint fai1ure. Vari0us parameter variations such as so1der joint height, ceramic chip carrier (CCC) size, printed c1rcuit substrate (PCS) materia1, etc. are investigated and discussed and samp1e estimates for a 0.65 x 0.65-in CCC are given.

Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:6 ,  Issue: 3 )

Date of Publication: Sep 1983

Page(s):
232 - 237
ISSN :
0148-6411
Digital Object Identifier :
10.1109/TCHMT.1983.1136183
Product Type:
Journals & Magazines
Date of Current Version :
06 January 2003
Issue Date :
Sep 1983
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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