By Topic

Physical Analysis of Data on Fused-Open Bond Wires

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Loh, Eugene ; Hughes Aircraft Company, El Segundo, CA, USA

Peddy's experimental data on fusing current, fusing time, and fused length of gold and aluminum bond wires used in transistors and integrated circuits are analyzed in terms of physical properties and size of the wire by simplified heat equations. Results of this physical analysis provide a useful guide to compare and extrapolate existing data and suggest steps in estimating fusing current and duration from an observed fused length on bond wires with known diameter, length, and material.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:6 ,  Issue: 2 )