By Topic

Corrosion Through Porous Gold Plate

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Krumbein, S.J. ; Fenton Avenue,Baychester, NY

The corrosion of base metals through porous gold plate adversely effects the reliability of electronic connectors. Little is known, however, of these corrosion mechanisms, especially with gold-plated nickel. Previous work had been concerned almost exclusively with sulfide tarnishing of gold-plated silver or copper. This paper considers the corrosion of gold-plated nickel in environments containing sulfur dioxide, and relates the morphology of the corrosion deposits to electrical contact behavior. In contrast to the spreading of thin sulfide films over gold-plated silver, the nickel salts are present mainly as discrete mounds, localized at the pore sites. The importance of humidity was determined and explained on the basis of the galvanic mechanism of S02-induced corrosion.

Published in:

Parts, Materials and Packaging, IEEE Transactions on  (Volume:5 ,  Issue: 2 )