Scheduled System Maintenance:
Some services will be unavailable Sunday, March 29th through Monday, March 30th. We apologize for the inconvenience.
By Topic

On Possible Thermal Degradation in Spirally Programmed Interconnection Wafer Technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Begg, I. ; University of St.Andrews,Scotland, U.K

A possible cause of difficulty in utilizing spiral programmed interconnection in full wafer technology is examined. This is the existence of hot spots. It is shown that hot spots are likely to occur and, in which case, to impair seriously the wafer performance. Means of avoiding such degradation are indicated.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:4 ,  Issue: 1 )