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Browse Journals & Magazines > Parts, Materials and Packagin ...> Volume:1 Issue:3 Help

The Use of Adhesives and Sealants in Electronics

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1 Author(s)
Delollis, N. ; Sandia Corporation, Sandia Base,Albuquerque, N.Mex

This paper surveys the wide variety of resin compounds available to meet the demands of modern electronics. It describes the properties and characteristics relevant to choosing a compound for a required performance and reliability and presents some guides for selection and use. Experimental data supports the discussion and comparison of resin properties.

Published in:
Parts, Materials and Packaging, IEEE Transactions on  (Volume:1 ,  Issue: 3 )

Date of Publication: Dec 1965

Page(s):
4 - 16
ISSN :
0018-9502
Digital Object Identifier :
10.1109/TPMP.1965.1135404
Product Type:
Journals & Magazines
Date of Current Version :
06 January 2003
Issue Date :
Dec 1965

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