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This paper describes the thermal analysis of a hybrid microcircuit to be used as a signal amplifier and conditioner for an IR tracking system. The details of circuit fabrication and an analysis of the electrical and noise performance of the circuit have been presented in a previous paper . It is the purpose of this paper to describe the use of computeraided analysis to determine the thermal performance of the circuit and to present a computer-aided approach to the thermal design of hybrid microelectronic circuits. Thermal analysis and measurements are made, revealing the temperature distribution and power-dissipating capability. These results also provide design guidelines for the layout of heat-dissipating devices such as amplifier chips. Package convection and radiation as well as internal heat conduction are modeled using node point analysis. Temperature measurements provide verification of the thermal models.