Referenced Items are not available for this document.
The flow stress of a high purity gold has been determined so that the contribution of plastic flow to the gold<jold thermocompression bonding process can be evaluated. These compression tests at 25°C, 158°C, 311°C, and 458°C indicate that for deformations over 15% the flow stress and the work hardening coefficient decrease rapidly with increasing temperature. Correlation of the compression test results and beam lead bonding experience indicates that high purity golds having a hardness of about 30 DPH would be expected to reach a steady state uniaxial flow stress of 70-90 MPa (10,000-13,000 psi) when deformed during bonding at 300°C.
Published in:
Parts, Hybrids, and Packaging, IEEE Transactions on
(Volume:11
,
Issue:
4
)
Date of Publication: Dec 1975
- Page(s):
- 290 - 296
- ISSN :
- 0361-1000
- Digital Object Identifier :
- 10.1109/TPHP.1975.1135079
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 January 2003
- Issue Date :
- Dec 1975
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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