Referenced Items are not available for this document.
A photoimagable polyimide layer which has been evaluated as a stress relief buffer for use with integrated circuits (ICs) packaged in plastic is discussed. The wafer-level overcoat process is manufacturable using available spin coat and develop tracks and is compared to conventional post wirebond die overcoating. Some properties of the polyimide layer, the manufacturing process, and the results achieved on actual commercial products are reviewed
Published in:
Advanced Semiconductor Manufacturing Conference and Workshop, 1990. ASMC 90 Proceedings. IEEE/SEMI 1990
Date of Conference: 11-12 Sep 1990
- Page(s):
- 72 - 74
- Meeting Date :
- 11 Sep 1990-12 Sep 1990
- INSPEC Accession Number:
- 3977044
- Conference Location :
- Danvers, MA
- Digital Object Identifier :
- 10.1109/ASMC.1990.111222
- Product Type:
- Conference Publications
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