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Capacitive impedance readout tactile image sensor

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1 Author(s)
Boie, R.A. ; Bell Laboratories, Murray Hill, New Jersey

The transduction of mechanical forces to representative electrical signals uses a three layer sandwich structure. The top layer is columns of compliant metal strips over a central elastic dielectric sheet. The bottom layer is a flexible printed circuit board with rows of metal strips and multiplexing circuits. Electrically, the sensor is a capacitor array formed by the row and column crossings with the middle layer functioning as a dielectric spring. A readout of the capacitor values corresponds to a sampled tactile image. The reasons for choosing this transduction method, the performance advantages of capacitive sensing and the design and integration of 64 element imagers into the fingers of a controlled compliance gripper are described.

Published in:

Robotics and Automation. Proceedings. 1984 IEEE International Conference on  (Volume:1 )

Date of Conference:

Mar 1984