By Topic

Finite size substrate and ground plane effects on propagation characteristics of planar interconnections

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kergonou, G. ; Inst. Nat. des Sci. Appliques, Rennes, France ; Drissi, M.

The groundplane and substrate finitudes are examined on the propagation characteristics of planar interconnections using the finite element method. The observed effects, for both truncations, are quantified and explained for the microstrip, coplanar waveguide (CPW) and stripline structures.

Published in:

Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on  (Volume:2 )

Date of Conference:

19-23 Aug. 2002