Skip to Main Content
To provide low-cost system solutions together with a 0.13-/spl mu/m dual-t/sub ox/ CMOS and multi-chip package (MCP) technologies, a new, so-called /spl mu/I/O architecture was developed. The /spl mu/I/O provides a common interface throughout the module and, thus, enables high design reusability and hierarchical I/O design for MCPs. The /spl mu/I/O includes a signal-level converter for integrating wide-voltage-range (0.75-1.3 or 1.5-3.6 V) circuit blocks, and a signal wall function for turning off each block independently - without invalid signal transmission - by using an internal power switch.
Date of Conference: 13-15 June 2002