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Monolithic interconnect technology has evolved rapidly over the past four decades in order to keep pace with advances in transistor density and performance. Optimal reverse scaling, integrated architectures for global signal, power and clock distribution networks of a heterogeneous system-on-a-chip, 3D integration and microphotonic interconnects offer promising approaches to satisfy future stringent monolithic interconnect requirements of GSI. Polylithic integration featuring batch processing of high density chip input/output interconnects and high density printed wiring board interconnects is projected as an increasingly important feature of future gigascale microsystems.
Date of Conference: 13-15 June 2002