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A simple model for the Mode I popcorn effect for IC packages with copper leadframe

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4 Author(s)
Alpern, P. ; Infineon Technol. AG, Munich, Germany ; Kheng Chooi Lee ; Dudek, R. ; Tilgner, R.

A simple model for the Mode I popcorn effect is presented here for packages with rectangular die pads (P-DSO). A package "stability parameter," relating to its moisture sensitivity, is derived from the popcorn model. It describes the critical factors for a robust package-molding compound properties and package, leadframe design for a given preconditioning and soldering process. Furthermore, nomograms generated from the model facilitate an easy estimation of moisture sensitivity levels (between 1 and 5) of packages with different die pad sizes and molding compound underpad thicknesses and for different soldering temperatures ranging from 220°C to 260°C (lead-free soldering)

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Components and Packaging Technologies, IEEE Transactions on  (Volume:25 ,  Issue: 2 )