Referenced Items are not available for this document.
A simple model for the Mode I popcorn effect is presented here for packages with rectangular die pads (P-DSO). A package "stability parameter," relating to its moisture sensitivity, is derived from the popcorn model. It describes the critical factors for a robust package-molding compound properties and package, leadframe design for a given preconditioning and soldering process. Furthermore, nomograms generated from the model facilitate an easy estimation of moisture sensitivity levels (between 1 and 5) of packages with different die pad sizes and molding compound underpad thicknesses and for different soldering temperatures ranging from 220°C to 260°C (lead-free soldering)
Published in:
Components and Packaging Technologies, IEEE Transactions on
(Volume:25
,
Issue:
2
)
Date of Publication: Jun 2002
- Page(s):
- 301 - 308
- ISSN :
- 1521-3331
- INSPEC Accession Number:
- 7303813
- Digital Object Identifier :
- 10.1109/TCAPT.2002.1010021
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 07 August 2002
- Issue Date :
- Jun 2002
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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