Low and high dose process monitoring using the BX-10 implant monitor system

The Boxer Cross BX-10 metrology tool was developed to provide in-line nondestructive measurement of critical ultra-shallow junction processes for sub-0.18 micron devices. Most of the experimental work to date has been on the use of the BX-10 to provide shallow junction depth measurements on annealed implants. However, capability has been demonstrated for the BX-10 to measure low dose and high dose process monitor wafers, and the ability of the BX-10 to provide implant monitoring supplements its role as an in-line junction depth monitor. This paper evaluates the statistical process capability of the BX-10 for monitoring low dose implants on nonannealed wafers and high dose implants on annealed wafers.