Advanced Compact Setups for Passive Intermodulation Measurements of Satellite Hardware

This paper provides the guidelines for the practical development of novel advanced test beds for passive intermodulation (PIM) measurements. The proposed test beds show high performance and are flexible, allowing for the measurement of several PIM signals of different orders, with two or more input carriers. In contrast to classic test beds for satellite hardware, based on the cascaded connection of several elements, an integrated solution involving the minimum number of hardware pieces is proposed. The result is a lower number of flanged interconnections, thus reducing residual PIM level and insertion losses. In addition, return loss degradation and harmful spurious generation in the interconnections are also avoided. Measurement test beds for conducted and radiated PIM, in both transmitted and reflected directions, are discussed, highlighting the benefits and drawbacks of each configuration. Design guidelines for the key components are fully discussed. Illustrative application examples are also reported. Finally, excellent experimental results obtained from low-PIM measurement setups, working from C-band to Ka-band, are shown, thus fully confirming the validity of the proposed configurations.