Inclusion of topside metal heat spreading in the determination of HBT temperatures by electrical and geometrical methods [GaAs devices]

Topside metal helps spread the heat dissipated by HBTs and reduces both the thermal resistance at a given temperature, and its temperature dependence. In this paper we describe new methods for including topside metal cooling effects in both an electrical method of extracting HBT temperature and a geometry-based method for calculating HBT temperatures.