Electrocontact microdisplacement testing subsystem

The subsystem relates to control, testing and measurement instrumentation with closed digital control loop structure. It may be used for testing and measurement of smooth displacements resulting from, for example, force or temperature deformation of an object, or for detection of charges in geometric dimensions of an object while monitoring its airtightness; in particular, when monitoring airtightness of integral microcircuits in cremate packages and watertightness of integral circuits in a watertight case. Also it may be used with some additions for tactile sensing in robotic systems.