Microstructure and fatigue resistance of solder interfaces

Summary form only given. The relationship between microstructure and fatigue resistance of solder interfaces was studied by examining micromechanisms and micromechanics of fatigue crack growth along a series of model interfaces. While the fatigue crack was seen to prefer staying in the solder when propagating at high rates, interfacial crack sliding was predominant in the near-threshold regime. A micromechanical model of interfacial crack sliding was developed, based on the interface fracture mechanics concept.