CAD for HMICs/MMICs including multilayer structures and MCM technology

The use of three and more conductor levels in RF, microwave and mm-wave hybrid (HMICs) and monolithic (MMICs) integrated circuits (ICs) and associated recent CAD development work is discussed. Multilayer IC configurations do not only allow compact wiring and interconnection in high speed digital ICs and in Multi-Chip Module (MCM) technology, but also provide new design options for vertically integrated, geometrically compact passive components with hitherto unachieved functionality and electrical performance. Following several years of experience with multilayer design and verification, respective layout-oriented CAD interfaces and algorithms are now reaching a first level of maturity.