Frequency-dependent crosstalk modeling for on-chip interconnections

An extensive study of crosstalk simulation issues for on-chip interconnections was performed for representative six-layer Al(Cu) structures. Guidelines are given for the range of conditions when R(f)L(f)C vs. RLC vs. RC representations are valid. Examples are also given of realistic short and long coupled-section interactions and the effect of in-plane neighbouring connections is discussed. Signal propagation and crosstalk are analyzed over the temperature range -160/spl deg/C to +100/spl deg/C and it is shown that Al(Cu) wiring can sustain 4.44 GHz processor frequency at T=+25/spl deg/C operation.