Model-based control of a copper micro plating process

The monitoring of a copper micro plating process by parameter estimation is investigated. The basis of the parameter estimation is a mathematical model of the relationship between electrical current density and potential which includes new approximations and which depends nonlinear on the parameters. The estimated parameters are used to adjust the copper micro plating process. In the first part of the paper the process is explained and the mathematical model including new approximations is presented. In the second part this model is used to estimate process parameters and results of measurement fits are shown followed by a conclusion.