A thermal benchmark chip: design and applications

A 1.2-/spl mu/m complementary metal-oxide-semiconductor (CMOS) thermal benchmark chip has been designed, fabricated and tested. The chip is suitable to support various steady-state and transient measurements, e.g., heating and cooling curves, in-chip thermal couplings. It facilitates the calibration of various chip temperature mapping equipment. Besides the description of the chip design experimental results are presented in order to demonstrate the wide usability of this measurement supporting tool.