A new screen printing process with important potential automotive applications

Potential automotive application-specific process developments are outlined which use thick polymer stencils that allow printing of a range of different height deposits at the same time. This paper looks at the use of this process for assembly in four areas: (a) double sided SMT assembly of designs with through-hole components; (b) double sided designs with surface mount components with a single reflow oven pass; (c) replacement of 'pin-dip' adhesive application, so that newer, smaller SMT components can be repeatedly and reliably assembled; (d) a simplified, in-line compatible, underfill assembly sequence which utilises screen printing only.