Soldered flip chip IC's in automotive applications

During recent years, we have accumulated a great deal of experience with high volume production of soldered flip-chips in small modules for automotive applications. We have processed more than 20 million flip chips with excellent results in terms of processing and reliability. There are several advantages for using hybrid flip chip modules for these applications. The reasons are given in this paper. Problems related to printing, mounting and soldering had to be solved, especially with respect to throughput. We therefore decided to screen print and place with a high speed placer, though stencils and fine pitch placers give higher accuracies. Nevertheless, we reached 2000 thermal cycles from -40/spl deg/C to +140/spl deg/C with this configuration without test failures; factory fall-off is less than 10 ppm.