Manufacturing process for combination lead frame/TAB BGA

The combination lead frame/tape automated bonding ball grid array (TAB BGA) has been studied to improve the manufacturability of thin ball grid array (TBGA) large scale integrated (LSI) packages. Ordinary lead frames and the TAB tape carriers have been applied to make the assembly of TBGA easier. The base technologies, the materials of the lead frame, and the TAB tape were thoroughly applied to the heat spreader and the fine routing flexible substrate. The lead frames as the heat spreader and the tape (manufactured by the line of the TAB tape for wire bonding substrate) are combined with a high thermal resistive adhesive (Tg473K). As the solder balls are reflowed prior to die attach, current assembly houses will never need the ball mounter to produce the TBGA.