Improving circuit speed through resin chemistry (a polycyanate resin for high speed PWB applications)

The knowledge that low aromatic polymers promote improved dielectric response allowed the development of a polycyanate resin from a cycloaliphatic/aromatic hybrid. This product allows improvement in dielectric properties without reduction in the enhanced thermal properties associated with triazine resins. The cured polycyanate (containing cycloaliphatic bridges between aromatic rings) is capable of a low dielectric constant over a wide temperature and frequency range. The improved dielectric properties of this resin can promote circuit speed increases from 14 to 25%. The product also exhibits the thermal stability characteristics of triazine-type cures offering a glass transition temperature of 256 degrees C. This cycloaliphatic/aromatic hybrid resin contributes both extremely low moisture absorption and relatively simple processing capabilities. The added benefit of low moisture absorption prevents the degradation of the dielectric and mechanical properties. This product appears well suited for applications where higher-speed components and excellent laminate heat stability are required.<
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