Fabrication of high density multichip modules

A novel high-density multilayer interconnect (HDMI) technology has been shown to provide very high functional densities and a fabrication platform for extremely compact and complex systems. The technology comprises an interconnect fabrication method for microelectronic circuits based on vacuum thin-film metallization and polymeric insulation between layers. The HDMI technology makes wafer-scale integration realistic by using a hybrid concept. Semiconductor devices can be built to the practical limit of reasonable yields, then regrouped on a substrate to achieve the desired level of integration. The technology is discussed in connection with photolithography, the effect of three-dimensional topography, alternatives for the definition of metal patterns, and the pattern of polymers.<
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