Three-dimensional integrated optical interconnect with laser and photodetector on SOI substrate

A three-dimensional on-chip optical interconnect with laser and photodetector is demonstrated using guided-wave silicon optical bench with 45-degree micro-reflector. Three-dimensional optical path is employed to connect laser and photodetector. The optical coupling efficiency between laser and photodetector is -1.74dB. 5-Gbps error-free data transmission with 6mA laser bias is measured.