Vertical optical power delivery and inter-chip interconnect concept based on surface-normal MQW modulators

A Chip-level EAM/MQW-based optical interconnect concept with vertically-coupled efficient CW VCSELs and inter-chip links is analyzed, enabled by a lithographically-defined high-density multi-mode waveguide fabric. Projected energy/bit, bandwidth density, and packaging tolerances enable scaling with foreseeable CMOS technology.