Evaluation of the fracture behaviour of surface mounted technology components by electrical measurements

SMT (surface mounted technology) components are exposed to mechanical stress during the assembly process of the modules. During an optical or/and electrical inspection these pre-damages may be not detected. But later this stress can cause permanent damage of the component. It is supposed that due to bending of damaged SMT components their electrical parameters will change. Damage will be inflicted by a newly developed tool called “drop tester”. In this article a new method of the pre-damage creation for SMT components and a new idea of the method for the damages research are presented. The results of the drop test of resistors before the soldering process are shown. And the results of the resistances' and capacities' changing during the bending process are introduced.