Telecommunications use environment application

This paper defines the telecommunications (telecom) product use environment conditions and describes the characteristics and technological constraints in high density electronic packaging for telecom product applications. A design approach is documented to guide new technology product development. This project attempts to establish a user-supplier linkage to translate the product use environment conditions into relevant physical design characteristics. Such information is necessary for cost-effective selection of components and materials used in building high density packaging modules. Whereas it is essential to specify the performance limits of a module when used in a product, it becomes imperative to have full knowledge of the end use product environment conditions. The relationship of module design and product application is addressed. The results of this project lay the ground work for further development of the packaging technology trends, broadening of the scope of applications, and harnessing the benefits derived from telecom product investments. The focus here is on realization of a new generation of physical design concepts that involve high density packaging and the selection of appropriate technologies as demanded in a rapidly evolving telecom industry.