The Synthesis of PS-Si02 Raspberry Structure Nanopartide for CMP Slurry

The properties of slurry particles are important factor on the polished surface quality in the CMP process. The composite abrasive is an interesting field in the CMP slurry study. And in this paper, we describe a method to synthesize raspberry structure PS-SiO2 composite nanoparticles and prepare the slurry for the wafer polishing. This novel composite abrasive can reduce the roughness and defects by the polishing experiment. Its removal rate is comparable to the commercial SiO2 slurry. The cushioning effect of soft PS core can decrease the excessive mechanical damage caused by hard silica abrasive. Keywords: Polystyrene SiO2 nanoparticle, Raspberry structure, CMP slurry