High frequency multilayer chip inductors

High frequency multilayer chip inductors for the application in the radio frequency telecommunication terminals were fabricated using low temperature sintered dielectric material. The thick-film printing and green sheet lamination processes were used for the chip fabrication. The inductors of 4.7, 12, and 22 nH were made, which exhibit self-resonant frequency of 5.3 to 2.4 GHz. The size of these monolithic inductors is 2.0 mm/spl times/1.2 mm/spl times/0.8 mm.