Dielectric properties of inorganic-organic silica-polyimide composite films prepared via sol-gel and thermal imidization processes

In this study, we prepared inorganic-organic silica-polyimide hybrid composite films from tetraethoxy silane (TEOS) and polyimide precursors via sol-gel process and thermal imidization. The dielectric properties of the silica-polyimide composite films were investigated. In particular, the dependence of the dielectric constant on the polyimide precursor types was discussed.