The design concept of system integration based on heterostructure

This study shows technological realization of heterostructure LTCC structure - HTCC substrate. Heterostructure realization results are analyzed regarding the application of LTCC ceramics and HTCC substrates where possible solution is local heat dissipation from power elements. Technological solution has been applied during the 3D integrations of mobile mini-machine control electronics in a System on Module (SoM) assembly.