Integration of environmental factors in process modeling for printed circuit board manufacturing. I. Assembly

This paper develops a planning methodology for integrating manufacturing related environmental factors into the design and control of production systems, with applications to printed circuit board assembly. Central to this methodology is the definition of manufacturing models for unit-level and batch processes that relate process parameters and component design features to waste streams, energy consumption, yield and process time. Process models for surface mount (stencil application and reflow soldering), through-hole component assembly (wave soldering), and board cleaning are developed. Metrics for workplace environmental hazard and cost are developed to guide design decisions. A case study is presented to illustrate the influencing factors in design and layout for a workstation motherboard.