Vertical-cavity surface-emitting lasers fabricated with efficient packaging method

Vertical cavity surface emitting lasers with large aperture were fabricated by using wet oxidation technique at about 420°C, and the device chips were packaged with three different packaging methods. The optical output power and wavelength shift of the devices were compared experimentally. The device bonded with diamond spreader shows the best performance, and 200μm-diameter device produces a room temperature continuous wave optical output power of 0.51W. The devices with larger aperture size were also fabricated in experiment.