Design considerations of 3-D single package communicator (SPC) for quad-band WCDMA/GSM cellular phone

A complete single package communicator (SPC) designed and implemented for 3G modem in 400 mm
²
size and 1.3 mm height, for the first time is presented. With the help of 3-D technology, development of highly integrated active/passive components and use of latest packaging technology, the design was doable. Optimization of the RF performance of all GSM and WCDAM channels was obtainable despite the small form factor. The design was taped out.