Designing clustered multiprocessor systems under packaging and technological advancements

Clustered or hierarchical interconnections have advantages when designing large scale multiprocessor systems. Earlier studies have either focused on only flat interconnections or proposed hierarchical/clustered interconnections with limited packaging and demanded performance constraints. Large systems require several levels of packaging. Packaging technologies impose various physical constraints on bisection bandwidth and channel width of a system. Pinout technologies and the capacity of packaging modules have been ignored in earlier studies, often leading to configurations that are not design-feasible. Similarly, the impact of processor and interconnect technologies on demanded performance has not been considered. We propose a new supply-demand framework for multiprocessor system design by considering packaging, processor, and interconnect technologies in an integrated manner. The elegance of this framework lies in its parameterised representation of different technologies. For a given set of technological parameters the framework derives the best configuration while considering practical design aspects like maximum board area, maximum available pinout, fixed channel width, and scalability. In order to build a scalable parallel system with a given number of processors, the framework explores the design space of flat k-ary n-cube topologies and their clustered variations (k-ary n-cube cluster-c) to derive design-feasible configurations with best system performance.