Assessment of Reliability Concerns for WideTemperature Operation of Semiconductor Devices and Circuits

Factors that may affect the long-term (30 yrs ?> 10⁶ h) reliability of electronic systems that can withstand temperature extremes (-150 to +300 °C) are discussed. There is ample evidence that a straightforward application of the Arrhenius equation, with activation energies determined from high-temperature accelerated stress testing, is not strictly valid for predicting real device lifetime. The relevance and validity of this traditional reliability assurance methodology, especially near the high-temperature operating limit, is critiqued. Some of the barriers to long-term reliable operation of devices and circuits subject to extreme temperatures are identified in the broad areas of: (1) semiconductor materials, (2) components and circuit design, and (3) packaging and assembly. Finally, alternative approaches to reliability assurance, not dependent on elevated temperature testing, which may be applicable to high-temperature electronics, are discussed.