Advanced Topics and Future Trends in MCM Technology

This chapter contains sections titled:

• Introduction

• Packaging Perspective

• Integrated Circuit Technology

• Integrated Circuit Technology Generations

• National Technology Roadmap for Semiconductors

• NTRS Assembly and Packaging

• Interconnect Technology Issues

• Emergence of MCM Technology

• Three-Dimensional (3-D) MCMs

• System-On-Chip

• Superconductor Interconnects

• Optical Interconnects

• Diamond Substrates

• Summary

This chapter contains sections titled:

• References

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