Fault-Tolerant ICs: The Reliability of TMR Yield-Enhanced ICs

The use of triple modular redundancy (TMR) for reliability enhancement is well known. This paper presents a simple method' for predicting the reliability of integrated circuits (ICs) which use TMR for yield enhancement. A simple yield-model is included as it is necessary to factor in the effect of consumption of redundancy paths due to wafer fabrication defects. TMR implementation is briefly discussed as well.