Digitized analog network model for the simulation of thermal systems and processes. Application to the determination of thermal diffusivity of solid materials

Presents a simulation model based on passive resistance networks. It has been applied to thermal diffusivity determination of solid materials, especially thermoelectric semiconductors. The model has proved to be very useful for interpreting data obtained under unsuitable conditions from the point of view of the conventional technique based on Angstrom's method. It has also been possible to process it digitally thus allowing for a quick and simple treatment of experimental measurements. The simulation is versatile and permits the extension of the original method to cases where the sample shortness would not fit the required boundary conditions. The model validity and accuracy has been previously checked by comparing its results with values obtained from semi-infinite specimens.<
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