High frequency characterization and modelling of inkjet printed interconnects on flexible substrate for low-cost RFID applications

This paper presents the characterization and modeling of inkjet printed interconnects on flexible polyimide substrate using nano-paticle silver ink for low-cost RFID applications. Then TDR/TDT and S-parameter measurements are performed at high frequency from 30 kHz to 6 GHz. A lumped equivalent circuit and distributed parameter model of the printed interconnects have been developed for the realization of the full printed RFID tags. Additionally the related electrical properties of the printed interconnects are extracted.