U-Type Target for High Rate Sputtering Method

A new type of sputtering target, which produces magnetic fields strong enough for magnetron sputtering of ferromagnetic targets, and a high concentration of particle beams was developed. The prototype target is a U-shaped target, but with no target material on the bottom of the "U". In experiments, a uniform 130 Oe field was applied from the sides of the target with an electromagnet. The measured angular distribution of sputtered particles suggested that some particles come from the bottom of the "U" which is covered by the material sputtered Å from both sides of the "U". At an Ar pressure of 6 mtorr and power input of 1 A and 640 V, deposition rates of up to 1500 Å/min were obtained.