Test Strategy for RF & Microwave Semiconductor Devices for Wireless Communications Market

Today’s RF and microwave semiconductor devices are being designed and manufactured in a new environment shaped in large measure by economic pressures. Prices are determined by the market and competition is intense. To be successful companies must minimize the amount of time needed to define, design, and document new products, the time needed to set up manufacturing lines, ramp-up production and introduce new products to the market. The emphasis is on manufacturing cost and product quality. Performance has to be just right, that is good enough for the intended application, as opposed to setting new records. To be successful one must put in place the right combination of manufacturing cost and capacity. Strategies employed here include designs resulting in the smallest possible die size, the utilization of plastic packages and process automation.